Electronics Inspection

PCB Solder Joint Inspection Lighting

PCB solder-joint lighting should be selected from joint reflection, component shadow, camera angle, field of view, and required defect evidence. Compare controlled on-axis, ring, and multi-angle illumination on representative good and bad boards before selecting a light family.

FocusDirect answer: which lighting should be tested?EvidenceInputs that change the selectionControlEvaluation before procurement

Direct answer: which lighting should be tested?

  • Coaxial lighting can be useful for controlled reflection from planar features.
  • Ring or multi-angle tests can be useful when component height, shadow, solder geometry, or viewing direction varies.
  • Final selection requires representative boards and the intended camera geometry.

Inputs that change the selection

  • Target defect, board finish, solder appearance, component height, camera angle, FOV, working distance, lens, and mounting space.
  • Motion, exposure, trigger, vibration, and any additional inspection tasks in the same station.

Evaluation before procurement

  • Check specular hotspots, component shadow, board-to-board finish variation, and contrast at actual line conditions.
  • Submit good and bad images or samples with camera, lens, FOV, WD, speed, and trigger constraints.
FAQ

PCB Solder Joint Inspection Lighting questions

Is coaxial lighting always appropriate for PCB solder joints?

No. It can be a useful test for controlled reflection, but component height, solder geometry, shadow, camera angle, and the target defect can make another geometry more appropriate.

What should I send for a PCB lighting review?

Send good and bad images or samples, the target defect, board finish, camera and lens, FOV, working distance, speed, trigger method, and mounting constraints.